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Semiconductor Applications
PiFM for Defect Review in Advanced Packaging Processes
Advanced packaging is a relatively recent innovation in semiconductor fabrication in which multiple devices (or dies) are bonded together prior to encapsulation.
Applying Photo Induced Force Microscopy (PiFM) for Automated Defect Review (ADR) in the Semiconductor Processes
PiFM introduction Photo-induced Force Microscopy (PiFM) is an advanced nanoscale characterization technique that integrates the…
Unambiguous Nanoscale Characterization of Self Assembled Monolayer Coverage
Introduction Surface functionalization via SAM (self-assembled monolayer) coverage is utilized in a range of fields,…
Measurement of -OH termination on hydrophilic surfaces
Background For successful Cu-Cu hybrid bonding to occur in the most demanding advanced packaging, the…
Analyzing sub-20 nm defects and ultrathin (~1 nm thick) residues in semiconductor processes
Background With shrinking semiconductor device sizes and modern advanced packaging processes, it is crucial to…
Nanoscale Chemical and Morphological Characterization of Ultrathin Atomic Layer Deposition Films
Atomic-layer-deposition (ALD) of various oxides can be utilized for diverse applications in the semiconductor industry,…
Nano Chemical Characterization Uncovers Coating Issues for Monolayer Surface Functionalization
Background Modifying surfaces to influence subsequent molecular interactions is a powerful technique. By adding functional…
Atomic-level Processing
As integrated circuit devices continue to shrink, surface layers have become a significant fraction of…
Cross-sectional IR PiFM Analysis
Multi-layers of different materials find usage across various applications. The thicknesses of the layers range…
PiFM Imaging of Latent EUV in t-BOC CA Resist
On EUV exposure of t-BOC resists, topographic differences arise between exposed and unexposed masked areas.…
PiFM and Multimodal Imaging of HAMR Devices
Topography, PiFM, and s-SNOM (at one harmonic of the dither frequency) images are acquired concurrently…
Cross-section of Multilayer Stack
A multilayer stack grown on silicon is cross-sectioned (via cleaving) and imaged by PiFM. In…